In the era of surging technological waves, every product is like a brave "explorer" venturing into the unknown, and it must demonstrate reliable performance in various extreme environments. The high and low temperature and low pressure test chamber is like a magical "environmental wizard.

In generic reliability standards such as GB/T 2423, IEC 60068 and MIL-STD-810, “damp heat” is treated as an independent climatic stress. The goal is not merely to verify moisture resistance, but to accelerate and expose failure modes triggered by water adsorption, condensation, “breathing” and electrochemical migration.

The thermal shock test chamber is a cornerstone of environmental-reliability testing. Within tens of seconds it transfers specimens between extreme high- and low-temperature zones, revealing mechanical stress, electrical degradation, and chemical instability induced by rapid thermal expansion and contraction.

Different models of constant temperature and humidity test chambers come in varying sizes. If customers are unfamiliar with the equipment, how should they determine the appropriate size?

Mastering the methods to troubleshoot low-temperature test chambers allows for timely repairs, ensuring the equipment can quickly resume normal operation. Below, we share some common faults and their solutions.